主催：フラウンホーファーENAS（エレクトロ・ナノシステム研究所）、東北大学 マイクロシステム融合研究開発センター(μSIC)
日時：2025年12月15日（月）
場所：東北大学片平さくらホール 2F会議室（仙台市青葉区片平2-1-1）
入場料：無料※
※ご参加の際は、以下の登録フォームよりお申し込みください。
Registration form for Fraunhofer Symposium
フラウンホーファーENAS お問い合わせ：fraunhofer-symposium@enas.fraunhofer.de Fax: +81 22 795 6259
| Monday | December 15, 2025 | 9.00 am - 7.30 pm | |
|---|---|
| 9.00 - 9.20 am | Greetings / Opening remarks Fraunhofer: Hideya Miki, Fraunhofer Representative Japan Tohoku University: Mr. Tsuyoshi Tohyama, Executive Vice President for Industry-University Collaboration, Tohoku University |
| 9.20 - 10.20 am | Keynotes MEMS Technology beyond MEMS Prof. Shuji Tanaka, Tohoku University Variable Shaped E-Beam Lithography - The Swiss Knife of Advanced Nanopatterning Ines Stolberg, Vistec Electron Beam GmbH |
| 10.20 - 10.45 am | Break + Exhibition |
| Session 1: Sensors and Integration | |
| 10.45 am - 12.05 pm | Versatile Applications of Sensor Platform LSIs: From MEMS-Based Robotic Tactile Networks to Human Motion Sensing in a Super-Aging Society Prof. Masanori Muroyama, Tohoku Institute of Technology Fluidic cooling for modular interposer architecture providing scalable heat removal, power delivery, and communication Dr. Manuela Junghähnel, Fraunhofer IZM-ASSID Recent advances in atomic diffusion bonding: room temperature bonding of wafers using inorganic thin films Prof. Takehito Shimatsu, Tohoku University Optomechanical Inertial Sensors Based on Ring Resonators: Design Approaches and Technology Franz Tank, Fraunhofer ENAS |
| 12.05 - 12.45 pm | Business matching pitches Companies/Institutes from Japan and Germany |
| 12.45 - 1.45 pm | Lunch break, exhibition and business matchmaking |
| 1.45 - 1.55 pm | Greeting Address and Introduction of Silicon Saxony Hightech Network Frank Boesenberg, Managing Director Silicon Saxony |
| Session 2: Digital twin, AI and testing | |
| 1.55 - 3.15 pm | Knowledge-Enhanced Process Modeling in CMP: A Case Study in Semiconductor Fabrication Dr. Jan Langer, Fraunhofer ENAS Integrating Process Workflows in Semiconductors: Linking Process Models via Multi-Sigma® AI Chain Analysis Mr. Hiroyuki Saito, AIZOTH Inc. European Test and Reliability Center Chemnitz (ETRC): A unique ecosystem for chip industry Dr. Alexander Weiß, Fraunhofer ENAS Test Challenges on Chiplets in The Era of Complexity Takatoshi Yoshino, Advantest Corporation |
| 3.15 - 3.40 pm | Break and exhibition |
| Session 3: Photonics and optical sensing | |
| 3.40 - 5.00 pm | Recent progress of VCSEL technology at RICOH: from Printing to 3D sensing Dr. Ryoichiro Suzuki, Ricoh Co., Ltd. Recent Advances and Future Prospects of OPTOWL Microdevices ~From Here, Greater Light~ Mr. Yasuhiro Fujimura, OPTOWL Co., Ltd. Ion implantation technologies for applications in Quantum Photonics and Optoelectronics Prof. Thoralf Gebel, HZDR Helmholtz Center Dresden Dielectric Metasurfaces for Next-Generation Optical Devices and Systems Prof. Kentaro Iwami, Tokyo University of Agriculture and Technology |
| 5.00 - 5.30 pm | Business matchmaking Companies/Institutes from Japan and Germany |
| 5.30 - 7.30 pm | Dinner reception |
東北大学片平さくらホール 2F会議室
12 15, 2025
英語
フラウンホーファー日本代表部