Research Institutes

The Fraunhofer Institute for Reliability and Microintegration IZM develops and implements new concepts for the assembly of highly integrated electronic systems. The work of Fraunhofer IZM bridges the gap between the providers of microelectronic components and technical system manufacturers (e.g. automotive or medical technology).

In 2008 the Departments “Module Integration and Board Interconnection Technologies (MDI&BIT)” and “Chip Interconnection Technologies (CIT)” merged to combine the research and development activities in the field of substrate interconnection technologies in one department called System Integration and Interconnection Technologies (SIIT). Here nearly 100 employees develop processes and materials for interconnection technology on board, module and package level as well as for integrating electrical, optical and power-electronic components and systems.

We assist companies with application-oriented pre-competitive research as well as the development of prototypes and small quantity production. In this context we offer application advice and technology transfer as well as the further qualification of personnel through practical training. We cooperate closely with the Technical University of Berlin (Center for Microperipheric Technologies), especially within the scope of European joint projects and in the area of basic materials research for the packaging of integrated circuits.

Our main focus is the interconnection and encapsulation technology in the area of electronic packaging, such as:

• New solders, adhesives, wires and bumps
• Bumping technologies (electroless Ni/(Pd)/Au, immersion solder, stencil printing, mechanical stud or ball bumping)
• SMD, CSP and BGA assembly
• Flip Chip technologies (soldering, adhesive joining, thermocompression and thermosonic welding)
• Die attachment (soldering and adhesive joining)
• Wire and ribbon bonding (US, TS, Heavy wire and ribbon
• Flip Chip underfilling and COB glob topping
• Transfer molding of flip chip, COB and component on lead frame devices
• Potting and conformal coating, hotmelt encapsulation
• Chip embedding
• Optical fiber and planar waveguide coupling, Fiber lenses and laser welding
• Thin glass and silicon photonics packaging

Furthermore we develop, functionalize and process innovative materials, such as:

• Bio polymers
• Nanoscale structured surfaces
• Additive metallizations
• Integration of optical waveguides

We particularly make every effort to meet the challenges of optical and power electronics, as well as the requirements of high-temperature and high-frequency applications.

Polytronic Systems

The department »Polytronic Systems» develops components and hetero-integration technologies for a cost-effective production of flexible systems, from low-cost electronic disposables to applications for most complex communication electronics. Production processes for thin and flexible silicon substrates in the range of less than 10 µm to 30 µm has been integrated in thinning, handling and separation processes suitable for all substrate thicknesses. Companies in the area of electronic product survey, electronic seal in safety paper, multi functional smart cards find support in the hybridintegration of electronics in thin substrates. Also to mention are applications in combination with other components like sensors and batteries and in the area of microsystems, such as medical disposables, lab-on-chip, plastic MEMS and bioanalyical systems. The development of ICs based on organic semiconductors produced by reel-to-reel low-cost processes, enables the integration of simple electronics on flexible plastic foils. The reel-to-reel application center provides an unique oportunity for the development and production of flexible systems by industrial equipment, enabling low-cost reel-to-reel development for electronics and microsystems on flexible substrates.

Vision - Further development of innovative handling techniques for ultra-thin semiconductor components allows the future integration of a multifunctional electronic system, consisting of ultra-thin layers of different semiconductor materials. So, by combination of thin - just a few microns - layers of silicon, gallium arsenide and optical active semiconductor levels, extremely small electronics with high computing power and high speed data transfer could be realized. Autarkic sensor nets in combination with RFID technology result in new applications for logistics, process- and medical technology. The technologies for cost-efficient application incorporate ultra-thin silicon chips as well as polymeric-electronic layer systems. Main focus of the reel-to-reel application center is the combination of RFID, sensor and flexible electronics. Further development of these technologies to cost-efficient microsystems, such as disposables, is of very high interest, considering the fast progress e.g. in life sciences. New approaches of IZM in health-, environment- and process-survey are based on the development of fully integrated, highly functional, polymer-based (bio-) sensorsystems.

Micro-Mechatronic-Systems

The Fraunhofer IZM department Micro-Mechatronic Systems, develops technologies for mechatronic systems containing mechanical, optical, electrical, power, chemical and software functions. Mechatronic assembly technology is the key to high performance mechatronic devices. Advanced research is performed with the focus on process simulation, novel interconnection methods focusing mechatronic applications and a variation of different encapsulation methods.

Fraunhofer IZM Micro-Mechatronic Center, is part of the department and represents a synergistic cooperation between industrial partners and acknowledged Fraunhofer IZM specialists to cover and fulfil the demands and market needs of small and medium-sized enterprises as well as large companies.One of the main objectives is the combination and cross linking of various software tools. This development sequence allows an entirely new perspective, taking into consideration the required functionality aspects at an early development stage to create innovative packaging solutions.

The application of simultaneous mechanical and electrical design combined with novel rapid prototyping concepts lead to shortest development times. Interconnection of the modules with electrical, mechanical and optical inter-faces is available, as well as assembly on 3-dimensional substrates. Advanced packaging solutions for electronic systems including the use of high performance polymers are the second focus of mechatronic system assembly. Detailed reliability investigations measuring thermal, dynamical, mechanical and chemical stresses complete their profile.