12th Fraunhofer Symposium in Sendai

Smart Integrated Systems for Different Applications

Date&Time: November 24, 2016, 9:30-17:30　Reception 17:40-19:45
Venue: Sunplaza Hotel
Entrance Fee: free (Pre-registration required)
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The 12^th Fraunhofer Symposium in Sendai will be held in cooperation with Tohoku University µSIC and the City of Sendai.

< PROGRAM >

9:30    Opening address
        Hideya Miki
        Fraunhofer Representative Office Japan, Representative

9:40 Session 1: Honorary speeches in remembrance of Prof. Geßner
Prof. Motoko Kotani - Tohoku University WPI-AIMR, Director

Prof. Masayoshi Esashi - Tohoku University, Micro System Integration Center Director

Prof. Thomas Otto - Fraunhofer ENAS, Director

Susumu Kaminaga - SPP Technologies Co., Ltd., Executive Senior Adviser

10:30 Break

Session 2:
10:40    “Fraunhofer Gesellschaft and Fraunhofer Representative Office Japan”
        Hideya Miki
        Fraunhofer Representative Office Japan, Representative

11:10    “Smart Integrated Systems – Trends and Tendency “
        Prof. Thomas Otto
        Fraunhofer ENAS, Director

11:40    “Advanced Assembly and Integration Technologies for Miniaturized Electronic Systems”
        Prof. Klaus- Dieter Lang
        Fraunhofer IZM, Director

12:10    “Open collaboration with industry and one example Massive Parallel Electron Beam Write (MPEBW)”
        Prof. Masayoshi Esashi
        Tohoku University

12:40    Lunch

14:00    “Smart Sensors for Next Generation Robots”
        Prof. Shuji Tanaka
        Tohoku University

14:30    "Smart Production Systems”
        Wolfgang Zorn
        Fraunhofer IWU; Manager Group System Integration

15:00    “An Overview on silicon Technologies, devices and 3d Integration at Fraunhofer EMFT Munich”
        Dr. Peter Ramm
        Fraunhofer EMFT

15:30    Break

16:00    “TBA”
        Toshiyuki Takahashi
        OMRON

16:30    "Wafer level bonding technologies”
        Prof. Joerg Froemel
        Fraunhofer Project Center at WPI-AIMR

17:00    “Diamond-based devices fabricated by wafer-to-wafer bonding”
        Dr. Vadim Lebedev
        Fraunhofer IAF

17:30    “Flexural vibration mode nanodiamond/AlN disk resonators for mass sensing applications”
        Taro Yoshikawa
        Fraunhofer IAF

18:00 Reception

Please fill out the registration form below and send via fax (+81-22-214-8321) or via E-Mail (kei008030@city.sendai.jp) by Nov.16th, 2016