14th IC Packaging Technology Expo

Date: January 16th - 18th, 2013
Venue: Tokyo Big Sight

A Researcher of Fraunhofer Institute for Reliability and Microintegration (IZM) will hold a talk at ICP Expo 2013.

January 18th (Fri) 13:30-16:00

[ICP-5] Market Landscape for Emerging Technology for Packaging System Integration

Advanced Integration and Packaging Technologies for Power Devices and Medical Systems
Klaus-Dieter Lang, Director of Fraunhofer IZM

For registration and detailed program of FC Expo 2013, please refer to the official homepage below:
14th IC Packaging Technology Expo