Events

Date&Time: Dec. 16-18, 2015, 10:00-17:00
Venue: Tokyo Big Sight
Entrance Fee: free
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Fraunhofer IZM-ASSID and Fraunhofer IPA will run booths at SEMICON Japan 2015 (Booth No.: 1809-2).

Furthermore, the both instituts have talks at the "Tech Spot West" on Dec. 17^th as follows:

TechSPOT West on Dec. 17th (Thu.) at Hall 1

11:20-12:10    „High Quality Level Cleanroom Manufacturing“
                            Dr. Udo Gommel, Fraunhofer IPA

»Industrie 4.0 Approach for Cleanroom Applications«
»Trends in Cleanroom Manufacturing, Equipment and Consumables Assessment«

12:50-13:40    “Heterogeneous System Integration – Technologies,
                            Design, Verification”
                            Karsten Einwich, Coseda Technologies
                            Jürgen Wolf, Fraunhofer IZM-ASSID

3D integration is a key technology in microelectronic packaging and enables a cost-efficient realization of highly complex systems.
The session deals with technological requirements, of 3D systems and how the challenges in design concerning the integration of heterogeneous analog, digital, hard- & software components can be mastered.