Fraunhofer IKTS at the Nano Tech 2009
Fraunhofer IKTS
 
 Fraunhofer IKTS will present you their nanopowder based HTCC and LTCC Components. 
 
Examples for HTCC Components: 
 - Pastes for sintered AIN (resistor, conductor, encapsulating) 
 - Tapes from Al2O3 and AIN 
 - Pastes for co-firing (Pt- or W-based) 
 - Prototypes of Heaters, Heat sinks, Ceramic housing or HTCC temperature sensor
  
Examples for LTCC Components: 
 - Via, innerlayer, top-layer pastes 
 - Processing technology 
 - Prototypes of Pressure sensor, Temperature sensor, Flow rate sensor or Housings
  
 Fraunhofer Representative Office Japan
                        Fraunhofer Representative Office Japan