6th Fraunhofer Symposium in SENDAI

Date & Time: Dec. 7, 2010
Venue: Sendai Sunplaza (http://www.sendai-sunplaza.com/hall/acsess.html)

The City of Sendai and Fraunhofer-Gesellschaft have a cooperation agreement since 2004 and have just prolonged for further three years.
This year, we are planning the "Sendai Micro Nano International Forum 2010" from Dec. 06-08 in Sendai as below:

Dec. 06: Tohoku University Micro System Integration Center Symposium
Dec. 07: German-Japanese Micro/Nano Applied Technology Symposium
Session 1: 6th Fraunhofer Symposium in SENDAI
Session 2: MEMS Park Consortium / AIST Tohoku Center Green Process Incubation Consotium Seminar
Dec. 06-07: 2nd International Nano/ Micro Application Contest (iCAN' 11)
Dec. 08: Lab Tour

FhG Symposium in SENDAI on December 7th (Tue.)
<PROGRAMM>

9:30-9:35
Opening
Ms. Emiko OKUYAMA (Mayor, the City of Sendai)

9:35-9:40
Welcome Address
Prof. Masayoshi ESASHI (Professor, WPI Advanced Institute for Material Research, Tohoku University)

9:40-9:55
Introduction of Fraunhofer-Gesellschaft
Dr. Lorenz GRANRATH (Representative, Fraunhofer Representative Office Japan)

9:55-10:30
Smart System Integration - Business Units and Core Competencies of Fraunhofer ENAS
Prof. Thomas GESSNER (Director, Fraunhofer Research Institution for Electronic Nano System ENAS)

10:30-11:05
System in Package - Technologies at Wafer and Board Level
Dr. Klaus-Dieter LANG (Director, Fraunhofer Institute for Reliability and Microintegration IZM)

11:05-11:40
On-Chip and 3D Interconnects in icroelectronics - Processes, Materials, Characterization -
Prof. Ehrenfried ZSCHECH (Division Director Nanoanalytics, Fraunhofer Institute for Non-Destructive Testing IZFP)

11:40-12:15
New Applications of Ultrathin Layers and Layer Systems in Micro- and Nanotechnology
Dr. Andreas LESON (Deputy Director, Fraunhofer Institute for Material and Beam Technology IWS)

12:15-13:30
Lunch

13:30-14:00
Metal Termo Compression Bonding for Wafer Level Packaging of MEMS
Mr. Joerg FROEMEL (Deputy Department Manager System Packaging, Fraunhofer ENAS)

14:00-14:30
Fusion Research Between WPI-AIMR and Fraunhofer
Prof. Yoshinori YAMAMOTO (Director, WPI Advanced Institute for Material Research, Tohoku University)

14:30-15:00
Japanese-German Cooperative Research on Innovative Material MEMS
Assis. Prof. Yu-Ching LIN (WPI Advanced Institute for Material Research, Tohoku University)

15:00-15:10
Introduction: Activity of the City of Sendai
Mr. HIroyuki MIYATA (Director, Industry Academia Collaboration Promotion Section, City of Sendai)

15:10
Closing

<REGISTRATION>
Please send the registration form (PDF file "Sendai Micro Nano International Forum 2010") to the following address:
Industry Academia Collaboration Promotion Section, City of Sendai
FAX: 022-214-8321, E-mail: kei008060@city.sendai.jp
by Nov. 26, 2010 (Fr.)