Events

15th International Micromachine Nanotech Symposium - MEMS World

Date & Time: July 29th, 10:30-16:45
Venue: Tokyo Big Sight, Seminar Room A
Organizer: Micromachine Center
Supporters: Ministry of Economy, Trade & Industry, NEDO

Director Fraunhofer ENAS (Research Institution for Electronic Nano Systems), Prof.Dr. GESSNER and Dr.SANDNER from Fraunhofer IPMS (Institute of Photonic Microsystems) will participate in the 15th International Micromachine Nanotech Symposium - MEMS World - on July 29th.


PROGRAM

10:30-10:35
Opening Remarks
Mr. Tamotsu NOMAKUCHI, Micromachine Center

10:35-10:40
Guest Speech
Mr. Takeshi YONEMURA, Manufacturing Industries Bureau, METI

- KEYNOTE SESSION - Concentration of R&D into Major International Institutes

10:40-11:10
MEMS in France: the R&D model and vision at LETI/MINATEC
Mr. Andre ROUZAUD, Silicon Heterogenous Integration Dept., CEA-LETI. MINATEC

11:10-11:40
Towards micro and nano technologies for integrated systems
Prof. Thomas GESSNER, Head of Fraunhofer ENAS

11:40-12:10
Worldwide Growth Opportunities for MEMS: MIG's Perspective on MEMS Activities in the US and Emerging Technologies
Ms. Karen LIGHTMAN, Managing Director, MEMS Industy Group

12:10-13:10 LUNCH

SESSION 1 - New World Explored by MEMS

13:10-13:40
Animal Watch Sensor System for Human Health and Food Safety
Dr. Toshihiro ITO, Group Leader, Networked MEMS Technology Group, AIST

13:40-14:10
Silicon Light Modulators: An Enabling Technology
Dr. Thilo SANDNER, Fraunhofer IPMS

14:10-14:40
Wearable Sensor Technologies for Realizing Safe, Secure and Healthy Societies
Prof. Kiyoshi ITAO, Tokyo University of Science

14:40-15:10
Harsh Environment Wireless MEMS Sensors for Energy & Power
Prof. Albert P. PISANO, Department of Mechanical Engineering, UC Berkeley, BSAC

15:10-15:20 BREAK

SESSION 2 - Latest Fabrication Process and Material Corresponding to Development Frontline

15:20-15:45
Can SOI break the MEMS law? A material supplier's view
Dr. Markku TILLI, Senior Vice President Research, Okmetic Oyj

15:45-16:10
Chip to Wafer bonding: The latest technology and future prospective
Mr. Sunil WICKRAMANAYAKA, Director of Technology Div., EVGroup

16:10-16:35
Hermetic packaging designs of MEMS: past and future prospective
Mr. Marco MORAJA, Business Manager, Getter for MEMS, SAES Getters S.p.A.

16:35-16:45
Closing Remarks
Mr. Kiichi AOYAGI, Micromachine Center

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